RELIFE RL-093B Chip heat sink copper sheet

1.Efficient and uniform heat diffusion,With high thermal conductivity, it can quickly and evenly transfer heat from the chip to the heat sink, improving the overall heat dissipation effect.

2.With high corrosion resistance, it is not easy to be oxidized or corroded, extending the service life of the heat sink.

3.Pure copper material,Smooth surface without sharp edges or burrs.