Showing 16–30 of 80 results
RELIFE RL-044 IPZ10
Rs.0.00RELIFE RL-044 IPZ10 A8-A15 CPU planting tin steel stencil
RELIFE RL-044 IPZ14 IP15-A16/A17 UNIVERSAL STENCIL
Rs.0.00PRECISION BGA STENCIL RELIFE RL-044 IPZ14 IP15-A16/A17 UNIVERSAL STEEL STENCIL
RELIFE RL-044 IPZ5
Rs.0.00RELIFE RL-044 IPZ5 IPXs/XsMax/Xr-A12 CPU Universal Stenci
RELIFE RL-044 IPZ7
Rs.0.00IP12/12Pro/12ProMax/12Mini-A14 CPU Universal Plant Tin Steel.
RELIFE RL-044 IPZ8
Rs.0.00The RELIFE RL-044 IPZ8 stencil is designed for repairing BGA ICs in iPhone IP13/13Pro/13ProMax/13Mini-A15
RELIFE RL-044 MQ1 Qualcomm MTK BGA stencil
Rs.0.00RELIFE RL-044 MQ1 Qualcomm MTK BGA stencil
RELIFE RL-044 MU2 BGA Stencils -MTK CPU-0.12MM
Rs.0.00- Brand: RELIFE
- Model: RL-044 MU2
- Usage: BGA stencil for MTK CPUs, 0.12mm thickness, designed for precision reballing.
- Application: Suitable for use in BGA reballing for mobile phone and motherboard repairs, ensuring accurate soldering.