MECHANIC 034 Main board layered Cutting Repair Tool Knife Kit

Solder Paste Scraping Knife for cell Phone BGA Repair and UV Glue Cleaning Tool.
IC/edge rubber removal
CPU /motherboard layered
Remove hard disk/baseband
Shovel glue/remove glue

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භාණ්ඩ ලැබීමෙන් පසු මුදල් ගෙවීමේ හැකියාව (Cash On Delivery).

2-3 Days

LKR 399/-

  • Warranty Available

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Description

Crescent Knife Overview

For iPhone A8 to A12 CPU BGA chip repairs, a crescent knife serves as an essential tool. This crooked knife is specially designed for the disassembly and cleaning of mobile phone motherboards, allowing technicians to pry open devices with ease.

Efficient Cleaning Capabilities

This tool excels in removing sealant glue, making it perfect for UV glue cleaning tasks. The design ensures that you can access hard-to-reach areas without damaging the motherboard, enhancing your repair efficiency.

Versatile Soldering and Glue Removal

In addition to its primary functions, the crescent knife is ideal for scraping solder paste. It adeptly removes glue from IC edges and the motherboard baseband, simplifying various repair processes. For anyone working with BGA repairs, this knife is a crucial addition to your toolkit.

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