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දිවයින පුරා බෙදා හැරීම
1-2 Days
1.It is suitable for separating dot matrix/board bottom glue removal/large chip removal/disconnection assistance, etc., to meet your maintenance needs.
2.The blade is hardened, the cutting edge is ultra-thin, the slope on both sides is polished at the same time, and the blade is evenly stressed on both sides from thick to thin, Super toughness, better protection of mobile phone chips.
3.Double-headed non-slip handle, low center of gravity more stable, Double cross chuck for firm grip, Firmly hold the blade, using multi-turn screw heads, the blade is easy to install and more secure, and there is no shaking in use.
Hurry and get discounts on all Apple devices up to 20%
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Rs.0.00
In stock
In stock
1-2 Days
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