SUNSHINE SS-101F IC REPAIR ADVANCED BLADE SET FOR SEPARATING DOT MATRIX – GLUE REMOVAL

  • Brand: SUNSHINE
  • Versatile Application: Ideal for separating dot-matrix, removing board bottom glue, large chip removal, and assisting with wire disconnection—perfectly tailored to meet diverse mobile phone repair needs.
  • Hardened Ultra-Thin Blade: The blade is specially hardened with an ultra-thin cutting edge, polished on both sides for even stress distribution, ensuring precision and efficiency in every cut.
  • Enhanced Toughness: Built with superior toughness to provide better protection for delicate mobile phone chips during repairs.
  • Stable Low Center of Gravity: Designed with a low center of gravity and a double-headed non-slip handle, offering enhanced stability and control during intricate repair tasks.
  • Universal Handle Design: Features a high-quality, universally compatible handle, guaranteeing a secure fit and robust performance across various repair scenarios.
  • Essential Repair Tool: A must-have for mobile phone repair professionals, suitable for hard disk removal, chip extraction, motherboard CPU layering, and other common repair tasks.

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  • දිවයින පුරා බෙදා හැරීම

භාණ්ඩ ලැබීමෙන් පසු මුදල් ගෙවීමේ හැකියාව (Cash On Delivery).

2-3 Days

LKR 399/-

  • Warranty Available

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