SUNSHINE SS-101F IC REPAIR ADVANCED BLADE SET FOR SEPARATING DOT MATRIX – GLUE REMOVAL
- Brand: SUNSHINE
- Versatile Application: Ideal for separating dot-matrix, removing board bottom glue, large chip removal, and assisting with wire disconnection—perfectly tailored to meet diverse mobile phone repair needs.
- Hardened Ultra-Thin Blade: The blade is specially hardened with an ultra-thin cutting edge, polished on both sides for even stress distribution, ensuring precision and efficiency in every cut.
- Enhanced Toughness: Built with superior toughness to provide better protection for delicate mobile phone chips during repairs.
- Stable Low Center of Gravity: Designed with a low center of gravity and a double-headed non-slip handle, offering enhanced stability and control during intricate repair tasks.
- Universal Handle Design: Features a high-quality, universally compatible handle, guaranteeing a secure fit and robust performance across various repair scenarios.
- Essential Repair Tool: A must-have for mobile phone repair professionals, suitable for hard disk removal, chip extraction, motherboard CPU layering, and other common repair tasks.
Apple Shopping Event
Hurry and get discounts on all Apple devices up to 20%
Sale_coupon_15
Rs.0.00
20
People watching this product now!
-
දිවයින පුරා බෙදා හැරීම
භාණ්ඩ ලැබීමෙන් පසු මුදල් ගෙවීමේ හැකියාව (Cash On Delivery).
2-3 Days
LKR 399/-
-
Warranty Available
Payment Methods:
Description
Reviews
Clear filtersThere are no reviews yet.