Description
SUNSHINE SS-101F IC REPAIR ADVANCED BLADE SET FOR SEPARATING DOT MATRIX – GLUE REMOVAL
- Brand: SUNSHINE
- Versatile Application: Ideal for separating dot-matrix, removing board bottom glue, large chip removal, and assisting with wire disconnection—perfectly tailored to meet diverse mobile phone repair needs.
- Hardened Ultra-Thin Blade: The blade is specially hardened with an ultra-thin cutting edge, polished on both sides for even stress distribution, ensuring precision and efficiency in every cut.
- Enhanced Toughness: Built with superior toughness to provide better protection for delicate mobile phone chips during repairs.
- Stable Low Center of Gravity: Designed with a low center of gravity and a double-headed non-slip handle, offering enhanced stability and control during intricate repair tasks.
- Universal Handle Design: Features a high-quality, universally compatible handle, guaranteeing a secure fit and robust performance across various repair scenarios.
- Essential Repair Tool: A must-have for mobile phone repair professionals, suitable for hard disk removal, chip extraction, motherboard CPU layering, and other common repair tasks.
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