“RELIFE 35g RL-403 BGA Solder Paste Flux – 183°C Mobile Phone Motherboard Repair Welding Flux” has been added to your cart. View cart
MECHANIC 138 PASTE CUP
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Description
- Type: Solder paste
- Weight: 42 grams
- Melting Point: 138°C
- Composition: Lead-free formulation
- Application: Ideal for surface-mount technology (SMT) and through-hole soldering
- Viscosity: Medium to high viscosity for precision application
- Features: RoHS compliant, excellent solderability, and good wetting properties
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