RELIFE RL-044 IPHONE (6-16) CPU STENCILS

The real machine is measured to ensure accuracy, and each stencil is checked according to the original factory drawings to ensure that every solder joint cannot be missing
It is specially designed and used for mobile phone chips. The round and square precise hole positions make the solder balls more rounded and meet the tin planting requirements for various chips.
Ultra-thin design, better fit of tin planting, continuous bending and full toughness
High-quality special steel is selected, which has good high temperature resistance and metal fatigue resistance, so that each tin point is heated evenly